SPK10-0.006-00-102

Bergquist Company
951-SPK10-006-102
SPK10-0.006-00-102

Fabricante:

Descripción:
Productos de interfaz térmica Insulator, 0.006" Thickness, 22x16.51mm, SIL PAD TSPK1300/K-10, IDH 2167654

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Disponibilidad

Existencias:
No en existencias
Plazo de entrega de fábrica:
4 Semanas Tiempo estimado de producción de fábrica.
Mínimo: 1120   Múltiples: 1
Precio unitario:
$-.--
Precio ext.:
$-.--
Est. Tarifa:

Precio (USD)

Cantidad Precio unitario
Precio ext.
$0.675 $756.00
$0.62 $1,550.00

Reemplazo posible

Bergquist Company SPK10-0.006-00-104
Bergquist Company
Productos de interfaz térmica Insulator, 0.006" Thickness, 25.4x19.05mm, SIL PAD TSPK1300/K-10, IDH 2167649
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Atributo del producto Valor de atributo Seleccionar atributo
Bergquist Company
Categoría de producto: Productos de interfaz térmica
RoHS:  
Thermally Conductive Insulators
Non-standard
Silicone Elastomer
6 kVAC
Brown (Beige)
- 60 C
+ 180 C
0.006 in
35 MPa
UL 94 VTM-0
K-10 / TSP K1300
Marca: Bergquist Company
País de ensamblaje: Not Available
País de difusión: Not Available
País de origen: US
Tipo de producto: Thermal Interface Products
Cantidad de empaque de fábrica: 1
Subcategoría: Thermal Management
Nombre comercial: Sil-Pad
Alias de las piezas n.º: L0.886INW0.65INH0.006 K10-102 BG80518 2167654
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Atributos seleccionados: 0

USHTS:
3921904090
ECCN:
EAR99

GAP PAD® Thermally Conductive Materials

Bergquist GAP PAD® Thermally Conductive Materials meet the electronic industry’s growing need for interface materials with greater conformability, higher thermal performance, and easier application. The extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps, and rough surface textures are present. The GAP PAD Thermally Conductive Materials are available in a variety of thicknesses and hardnesses, a range of thermal conductivity ratings, in sheets or die-cut parts, and with fiberglass/rubber carrier or non-reinforced versions. GAP PAD products are well suited to a wide variety of electronic, automotive, medical, and aerospace/defense applications.

Thermal SIL PAD® Materials

Bergquist Company Thermal SIL PAD® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The Bergquist SIL PAD materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible. The SIL PAD materials feature reinforcements to resist cut-through, a wide range of thermal conductivities and dielectric strengths, and excellent thermal performance with minimized thermal resistance. These cost-effective materials are resistant to electrical shorting and enhance performance for high-heat compacted assemblies.

Green Energy

Bergquist Company Green Energy products are designed to improve alternative energy conversion and storage, boosting the efficiency of solar power networks. Harnessing power from the sun and other energy sources advances sustainability efforts while increasing the amount and availability of global power, even in places that have limited infrastructure. This green energy product lineup from Bergquist features robust products ideal for solar power inverters, solar power optimizers, industrial battery chargers, and lithium-ion batteries.

Industrial Automation

Bergquist Industrial Automation provides advanced materials that are crucial in groundbreaking industrial automation technologies and the advancement of Industry 4.0. Industrial processes are changing, and artificial intelligence (AI), machine learning, robotics, and the Industrial Internet of Things (IIoT) are moving mainstream. These developments make it critical to have the right material and components to dissipate heat, protect electronics in harsh environments, secure components, and deliver electrical integrity.

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