EasyPACK™ CoolSiC™ Trench MOSFET Modules

Infineon Technologies EasyPACK™ CoolSiC™ Trench MOSFET Modules feature PressFIT contact technology and an integrated Negative Temperature Coefficient (NTC) temperature sensor. These modules operate at a 1200V drain-source voltage, feature a low inductive design, low switching losses, and high current density. The EasyPACK™ modules offer rugged mounting due to integrated mounting clamps and are packaged with a CTI >600. Applications include high-frequency switching devices, DC/DC converters, and DC chargers for EVs. With the Easy 2C Series, Infineon enhances high-power designs using SiC G2 technology and advanced .XT features. The .XT technology provides enhanced ruggedness and extended operating temperatures, while the second-generation SiC MOSFET technology offers improved gate oxide reliability and reduced on-resistance.

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Infineon Technologies Módulos MOSFET EasyPACK 2C CoolSiC MOSFET M2 .XT, 3-level module 1200 V, 8 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
Hoja de datos
16En existencias
Min.: 1
Mult.: 1

MOSFET Modules SiC Press Fit
Infineon Technologies Módulos MOSFET EasyPACK 1C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 13 mOhm with NTC temperature sensor and high current PressFIT contact technology
Hoja de datos
25En existencias
Min.: 1
Mult.: 1

MOSFET Modules SiC Press Fit
Infineon Technologies Módulos MOSFET EasyPACK 2C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 8 mOhm with NTC temperature sensor and high current PressFIT contact technology
Hoja de datos
19En existencias
Min.: 1
Mult.: 1

MOSFET Modules SiC Press Fit
Infineon Technologies Módulos MOSFET EasyPACK 2C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 8 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
Hoja de datos
12En existencias
Min.: 1
Mult.: 1

MOSFET Modules SiC Press Fit
Infineon Technologies Módulos MOSFET EasyPACK 2C CoolSiC MOSFET M2 .XT, 3-level module 1200 V, 8 mOhm with NTC temperature sensor and high current PressFIT contact technology
Hoja de datos
6En existencias
30En pedido
Min.: 1
Mult.: 1

MOSFET Modules SiC Press Fit
Infineon Technologies Módulos MOSFET EasyPACK module with CoolSiC Trench MOSFET and PressFIT / NTC
Hoja de datos
15En existencias
Min.: 1
Mult.: 1

MOSFET Modules SiC Press Fit
Infineon Technologies Módulos MOSFET EasyPACK module with CoolSiC Trench MOSFET and PressFIT / NTC
Hoja de datos
3En existencias
Min.: 1
Mult.: 1

MOSFET Modules SiC Press Fit
Infineon Technologies Módulos de semiconductores discretos EasyPACK module with CoolSiC Trench MOSFET and High Current Pin / NTC
Hoja de datos
13En existencias
8En pedido
Min.: 1
Mult.: 1

Discrete Semiconductor Modules SiC Press Fit
Infineon Technologies Módulos MOSFET EasyPACK 1C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 13 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
Hoja de datos
30En pedido
Min.: 1
Mult.: 1

MOSFET Modules SiC Press Fit